| Material | Substrate | Secondary Battery Separator |
| Std. Substrate Size | Width 600mm(Movement method : Roll to Roll) | |
| Laser | Wavelength [um] | 9.3 |
| Average power [W] | 400 | |
| Repetition rate range [kHz] | 0 ~ 100 | |
| Pulse width [us] | 2 ~ 400 | |
| Polarization | Linear | |
| Scanner | Wavelength [um] | 9.4 |
| Entrance aperture[mm] | 16 | |
| Interface | SL2-100 | |
| Water cooling | 3 l/min, p < 4.5 bar | |
| Weight | 35 kg | |
| Tracking error | < 0,45 ms | |
| Typical positioning speed | 20 rad/s | |
| Controller board | Scanlab RTC Control boards |
LASER APPLICATION
Laser Diode Control System
Industrial Laser Materials Processing
LASER APPLICATION
Laser Diode Control System
Industrial Laser Materials Processing
Secondary Battery Separator
Laser Cutting Module
High-speed cutting system of secondary battery separator using CO2 laser(with roll to roll logistics).
- A machine that cuts high-speed moving battery materials with a laser
- more than 15,000mm/s cutting speeds available
Specification
Machine Key Specification.
ITO Patterning
Provides high-speed, high-quality laser patterned for ITO-coated film/glass.
- Device for Patterning of ITO-coated film/glass
Specification
Machine Key Specification.
| Material | Substrate | PDLCD | |
| Std. Substrate Size | 400 * 400mm (TBD) | ||
| System | Std. System Size | 1,500(L) * 2,200(W) * 1,900(H) | |
| System Weight | Approx. 1,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Cutting Station | Pin Hole with Vacuum | ||
| Stage Flatness | ± 50um | ||
| Max Marking Speed | >500mm/s | ||
| Laser Marking Accuracy | ≤ ±20um | ||
| Vision Align | Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
3D Film Cutting Module
Provides precise cutting of films attached to 3D molded glass such as curved surfaces.
- Laser Cutting the Vairous films attached to the 3D molded glass
Specification
Machine Key Specification.
| Material | Substrate | Film (with 3D Glass LAMI) | |
| Std. Substrate Size | 400 * 400mm (TBD) | ||
| System | Std. System Size | 1,500(L) * 2,200(W) * 1,900(H) | |
| System Weight | Approx. 1,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Cutting Station | Pin Hole with Vacuum | ||
| Stage Flatness | ± 50um | ||
| Max Marking Speed | >500mm/s | ||
| Laser Marking Accuracy | ≤ ±20um | ||
| Vision Align | Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
We Focus On The Laser.
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