Material | Substrate | Films / PCB / Glass / food container / any sheet type subst. | |
Std. Substrate Size | 200 * 200mm (TBD) | ||
System | Std. System Size | 2,100(W) * 1,800(D) * 2,200(H) (TBD) | |
System Weight | Approx. 2,500kg | ||
System Pass Line | 1,000mm±50mm (TBD) | ||
Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
Cutting Station | Pin Hole with Vacuum | ||
Stage Flatness | ± 100um | ||
Max Marking Speed | 500mm/s | ||
Laser Marking Accuracy | ± 100um | ||
Water and dust IP ratings | IP 67 / 66 (option)_Laser Head | ||
Vision Align | Camera | 1024 X 768mm | |
FOV | 4.8 X 3.6mm | ||
Resolution | < 3.0 um | ||
Laser Source | Optimizing your applications. | ||
System Control | Laser + Vision + UI + Sequence control _ PC |
LASER MARKER
Laser Diode Control System
Industrial Laser Materials Processing
LASER MARKER
Laser Diode Control System
Industrial Laser Materials Processing
Specification
Machine Key Specification.
Marking Module
Marking (Cutting/Patterning) device using various lasers.
- Easy maintenance and operation
- Remote control interfaces
- Applicable to various wavelengths/types of laser → Optimized for various material conditions
- Continuous upgrade support
- Waterproof IP67/IP 66 Grade of Laser Head – Response to high humidity production environment
Specification
Machine Key Specification.
Material | Substrate | Films / PCB / Glass / food container / any sheet type subst. | |
Std. Substrate Size | 200 * 200mm (TBD) | ||
System | Water and dust IP ratings | IP 67 / 66 (option)_Laser Head | |
Laser Power [W] | 20 / 5 / 2 | ||
Wavelength [nm] | 1,064 / 532 / 355 | ||
Speed [mm/s] | ≤ 500 | ||
M2 | < 1.5 / 2.0 / < 1.2 | ||
Output power stability(typical)[%] | 3 / 1 / < 5 | ||
Operating Conditions | Power Supply | 220VAC, 60Hz | |
Temperature [°C] | 15 ~ 35 | ||
Humidity [%] | 10 ~ 90 | ||
Cooling | Forced Air Cooling or Water |
We Focus On The Laser.
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