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LASER MARKER

Laser Diode Control System
Industrial Laser Materials Processing

LASER MARKER

Laser Diode Control System
Industrial Laser Materials Processing

Marking System

Marking (Cutting/Patterning) device using various lasers.

- Easy maintenance and operation
- Remote control interfaces
- Applicable to various wavelengths/types of laser → Optimized for various material conditions
- Continuous upgrade support

Specification

Machine Key Specification.

MaterialSubstrateFilms / PCB / Glass / food container / any sheet type subst.
Std. Substrate Size200 * 200mm (TBD)
SystemStd. System Size2,100(W) * 1,800(D) * 2,200(H) (TBD)
System WeightApprox. 2,500kg
System Pass Line1,000mm±50mm (TBD)
Subst. Load/UnloadManual Loading (TBD) – Auto available
Cutting StationPin Hole with Vacuum
Stage Flatness± 100um
Max Marking Speed500mm/s
Laser Marking Accuracy± 100um
Water and dust IP ratingsIP 67 / 66 (option)_Laser Head
Vision AlignCamera1024 X 768mm
FOV4.8 X 3.6mm
Resolution< 3.0 um
Laser SourceOptimizing your applications.
System ControlLaser + Vision + UI + Sequence control _ PC

Marking Module

Marking (Cutting/Patterning) device using various lasers.

- Easy maintenance and operation
- Remote control interfaces
- Applicable to various wavelengths/types of laser → Optimized for various material conditions
- Continuous upgrade support
- Waterproof IP67/IP 66 Grade of Laser Head – Response to high humidity production environment

Specification

Machine Key Specification.

MaterialSubstrateFilms / PCB / Glass / food container / any sheet type subst.
Std. Substrate Size200 * 200mm (TBD)
SystemWater and dust IP ratingsIP 67 / 66 (option)_Laser Head
Laser Power [W]20 / 5 / 2
Wavelength [nm]1,064 / 532 / 355
Speed [mm/s]≤ 500
M2< 1.5 / 2.0 / < 1.2
Output power stability(typical)[%]3 / 1 / < 5
Operating ConditionsPower Supply220VAC, 60Hz
Temperature [°C]15 ~ 35
Humidity [%]10 ~ 90
CoolingForced Air Cooling or Water
We Focus On The Laser.

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