| Material | Substrate | Metal material (TBD) | |
| Std. Substrate Size | 400mm x 500mm (TBD) (not limited in work size) | ||
| System | Std. System Size | 2,820(W) * 1,100(D) * 1,956(H) (TBD) | |
| System Weight | Approx. 3,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Movement method | Roll to Roll | ||
| RTR Flatness | ± 200um | ||
| Max Process Speed | 100mm/s | ||
| Process Width | 50~200㎛ | ||
| Vision Align | Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
LASER SYSTEM
Laser Diode Control System
Industrial Laser Materials Processing
LASER SYSTEM
Laser Diode Control System
Industrial Laser Materials Processing
Peel Off System
Peel off the Au and Ni layers of the connector using a laser (with roll to roll logistics).
- Optimized Optical system for Peel Off : Long DOF optical system / Co-axial Vision with Fiber opitcs
- Fully automated line system with articulated robot Arms
Specification
Machine Key Specification.
Wafer BG Tape Free LAMI.
& Laser Cutting System
Cutting equipment using a laser after lamination of film on wafer.
- Free Tension Lamination of Wafer Back Grinding Film
- Laser cutting of film - Offset can be set freely from the wafer edge
Specification
Machine Key Specification.
| Material | Substrate | Films / PCB / Glass / any sheet type subst. | |
| Std. Substrate Size | 8”~12” Wafer | ||
| System | Std. System Size | 2,500(W) * 2,600(D) * 1,600(H) (TBD) | |
| System Weight | Approx. 3,500kg | ||
| System Pass Line | 800mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Movement method | Roll to Roll | ||
| Stage Flatness | ± 25um | ||
| Max Process Speed | >200mm/s | ||
| Laser Cutting Accuracy | ≤ ±10um | ||
| Vision Align | Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| Laser Source | Optimizing your applications. | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
Large Area Glass Cut
Large-area precision equipment for Glass/
film processing using scanners and stages.
Specification
Machine Key Specification.
| Material | Substrate | Films / PCB / Glass / any sheet type subst. | |
| Std. Substrate Size | 500mm x 500mm (TBD) (not limited in work size) | ||
| System | Std. System Size | 2,500(W) * 2,600(D) * 1,600(H) (TBD) | |
| System Weight | Approx. 2,500kg | ||
| System Pass Line | 1,000mm±50mm (TBD) | ||
| Subst. Load/Unload | Manual Loading (TBD) – Auto available | ||
| Cutting Station | Pin Hole with Vacuum or Porous | ||
| Stage Flatness | ± 25um | ||
| Max Cutting Speed | >200mm/s | ||
| Laser Cutting Accuracy | ≤ ±10um | ||
| Vision Align | Camera | 1,024 X 768mm | |
| FOV | 4.8 X 3.6mm | ||
| Resolution | < 3.0 um | ||
| ESD | CDA – Air blow, Anti-ESD coating material | ||
| System Control | Laser + Vision + UI + Sequence control _ PC | ||
We Focus On The Laser.
Have any questions or ideas?
Feel free to contact us!
